Pointe Claire, Quebec (realtimepressrelease) February 9, 2016 – Future Electronics, a global leading distributor of electronic components, recently announced immediate availability of Fairchild’s Dual Cool™ MOSFET packaging technology.
Fairchild’s Dual Cool™ MOSFET packaging technology provides both bottom- and top-side cooling in the industry standard PQFN package, offering performance flexibility for designers. With enhanced dual-path thermal performance and improved parasitics over its wire-bonded predecessors, the use of a heat sink provides even more impressive results. Lab testing demonstrates that when a heat sink is used with Dual Cool package technology, synchronous buck converters deliver higher output current and increased power density. With Fairchild’s trench silicon technology, Dual Cool packaging proves to be a clear leader both in power density and thermal performance. Dual Cool solutions are lead-free, RoHS-compliant, and come in 3.3 x 3.3, 5 x 6, and 8 x 8 PQFN packages.
Typical applications for Faichild’s Dual Cool MOSFET packaging technology include Point of Load (POL) synchronous-buck conversion, servers, telecommunications, routing, and switching.
For more information about Fairchild, MOSFET, thermal resistance, power dissipation, or highest power density, as well as access to the world’s largest available-to-sell inventory, visit www.FutureElectronics.com
About Future Electronics
Future Electronics is a global leader in electronics distribution, ranking 3rd in component sales worldwide, with an impressive reputation for developing efficient, comprehensive global supply chain solutions. Founded in 1968 by Robert Miller, the company has established itself as one of the most innovative organizations in the industry today, with 5,000 employees in 169 offices in 44 countries around the world. Future Electronics is globally integrated, with one worldwide IT infrastructure providing real-time inventory availability and access, while enabling full integration of its operations, sales and marketing worldwide. Offering the highest level of service, the most advanced engineering capabilities and technical solutions through all stages of the design-production cycle, and the largest available-to-sell inventory in the world, Future’s mission is always to Delight the Customer®. For more information, visit www.FutureElectronics.com.
Martin H. Gordon
Director, Corporate Communications
514-694-7710 (ext. 2236)